HESCO
StructuredGround™ GB2B0304TPI-1 Telecom Grd Busbars, 0304, Copper, Tin-Plated
Panduit

StructuredGround™ GB2B0304TPI-1 Telecom Grd Busbars, 0304, Copper, Tin-Plated

MFG #GB2B0304TPI-1

$156.85 / e
EACH
Product Description:
The GB2B0304TPI-1 Grounding Busbar meets BICSI and ANSI/TIA-607-D requirements for network systems grounding applications. Made of high conductivity copper and tin-plated to inhibit corrosion, comes pre-assembled with brackets and insulators attached for a quick installation. The insulators provide 600 V of insulation and use of Panduit self-laminating laser/ink jet labels to identify busbars.
HESCO Part Number
PANGB2B0304TPI1
UPC
074983659265
Manufacturer Part Number
GB2B0304TPI-1
Manufacturer
Panduit
Panduit

StructuredGround™ GB2B0304TPI-1 Telecom Grd Busbars, 0304, Copper, Tin-Plated

MFG #GB2B0304TPI-1

Product Description:
The GB2B0304TPI-1 Grounding Busbar meets BICSI and ANSI/TIA-607-D requirements for network systems grounding applications. Made of high conductivity copper and tin-plated to inhibit corrosion, comes pre-assembled with brackets and insulators attached for a quick installation. The insulators provide 600 V of insulation and use of Panduit self-laminating laser/ink jet labels to identify busbars.
HESCO Part Number
PANGB2B0304TPI1
UPC
074983659265
Manufacturer Part Number
GB2B0304TPI-1
Manufacturer
Panduit
$156.85 / e
EACH
  • No
  • Standards Met: BICSI/TIA-607-D, cULus Listed for Grounding and Bonding Equipment